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5" Diamond Wafering Blade (Medium Grit / High Conc.), WB-0055HC Size:5-Inch 45 micron DIAMAT Monocrystalline Water-Based

SKU: 72312918775

4.5
USD336.00 USD381.00

Pay in 4 interest-free payments of $84.00 Learn more

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Ships within 48 hours · Estimated delivery Aug 1 - Aug 6

Description

45 micron DIAMAT Monocrystalline Water-Based Diamond Abrasive Suspension

12-inch 800 grit SiC PSA (adhesive backed) Abrasive Grinding papers

available in small

25-inch) MAXCUT alumina/resin bonded abrasive blade (MOS 3200 rpm) (Hardened steels)

5" Diamond Wafering Blade (Medium Grit / High Conc.), WB-0055HC Size:5-Inch 45 micron DIAMAT Monocrystalline Water-Based5 inch Diamond Wafering Blade (medium grit, high conc.)

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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